Leo(Wenzhuo) Zhao

M.S. Student in ECE @ University of Pittsburgh

Ex-Field Application Engineer (Consumer Electronics)

I am a Master's student in ECE at the University of Pittsburgh with a strong background in embedded systems and technical support. With 2+ years of experience as a Field Application Engineer (FAE) in Shenzhen, I specialize in bridging the gap between R&D and client applications.

Email Me Resume

PROFESSIONAL EXPERIENCE

Field Application Engineer
Techvision Intelligent Technology
March 2025 - December 2025 | Shenzhen, China

Acted as the primary technical liaison for Commercial AIoT solutions (POS, Industrial, Medical).

Defined system-level architectures and SoC selection, ensuring optimal hardware-software compatibility.
Implemented enterprise-grade MDM policies and Cloud Desktop solutions for device provisioning.
Managed technical support for Consumer Smart Terminals (AI PCs, AI Tablets) and drove complaint resolution.
Utilized C/C++/Python for debugging and executed containment plans for defective products.

Field Application Engineer
Koryo Electronics Shenzhen
July 2023 - September 2024 | Shenzhen, China

Provided technical support and business development for MCU and MOSFET product lines.

Redesigned control algorithms to reduce EM noise by 15% and developed thermal paths reducing temperature rise by 12°C.
Resolved critical production failures to secure a $1.5M project and won multi-million unit automotive orders.
Authored 8D and Failure Analysis reports, significantly reducing defect rates and delivery cycles.

LABORATORY & ROUTINE

**Trigger Tuning** Fine-tuning signals on a portable tablet oscilloscope. I am adjusting the Horizontal Timebase via touch interaction to capture transient Undershoot Pulses, enabling precise measurement of the switching frequency.

**Analysis of 5G Performance** Under lab conditions, I conducted a synchronized performance benchmark of 5G SA networks across multiple devices using Cellular-Z. By monitoring real-time RSRP and SINR, I analyzed the link quality variations of different hardware within the same network topology.

**Analysis of 5G Physical Layer** This session focused on testing 5G base station coverage. I recorded the NR-ARFCN and PCI of the serving cells while tracking signal fluctuations of Neighboring Cells to provide data support for optimizing handover logic.

**Firmware Repository** A collection of storage media used throughout the project. These drives, ranging from USB Type-A to Type-C, carry various Firmware Images and OS bootloaders for rapid environment deployment across embedded platforms.

**Hardware Debugging** A snapshot of a typical circuit debugging session. I established physical connections using Alligator Clips to lead out key signal nodes from the control board, preparing for subsequent Multi-channel Signal Analysis.

**Multi-channel Signal Logic Capture** Capturing complex analog signals in real-time using a Tektronix MDO34 oscilloscope. By analyzing the Period and peak values of the CH4 (green) waveform, I verified the dynamic response characteristics of the circuit under specific loads.

**Thermal Management** This setup involves precision soldering and thermal stress testing. The BY1515 heating station (left) simulates various operating temperatures, while the organized components (right) include high-performance MOSFETs and peripheral power devices.

**Motor Commutation Algorithmic Logic Derivation** A handwritten manuscript of the motor drive algorithm design. By deriving the timing diagrams and Truth Tables, I defined the Hall sensor signal sequences for both forward and reverse modes, laying the foundation for firmware logic implementation.

**HDMI transmitter Development** A snapshot of a typical hardware-software co-debugging session. I am using my laptop to interface with an embedded control board via terminal, while leveraging the large meeting room display for data monitoring or reference. This multi-screen setup significantly enhances debugging efficiency during complex logic implementation.

**PMSM Control Algorithm Derivation** The whiteboard serves as my primary tool for capturing insights when tackling PMSM (Permanent Magnet Synchronous Motor) control algorithms. The sketches document the derivation of FOC (Field-Oriented Control) logic and the mapping between current and speed loops—a critical bridge between mathematical formulas and production code.

**Transient Capture of Motor Startup Current** Using a Keysight oscilloscope to capture the current surge during motor startup. By configuring precise trigger levels, I recorded a Peak-to-Peak current fluctuation of 7.36A, which is essential for evaluating the Over-Current Protection (OCP) of power devices.

**Multi-Channel Thermal Rise Monitoring** Utilizing a Yokogawa data logger for long-term thermal rise testing of power modules. The real-time curves illustrate temperature trends at critical sensing points under load, with peak temperatures reaching 92.5°C, providing direct experimental evidence for thermal management optimization.

**Thermodynamic Calculation for Power Devices** To address thermal failure in MOSFETs at high power, I performed detailed thermal resistance modeling. By deriving Junction Temperature formulas and comparing various heat-sink packaging solutions, I quantified the impact of air thermal conductivity on overall temperature rise.

**Power Supply Prototype** Showcasing the internal structure of a power supply prototype I assembled. Featured are the core Toroidal Transformer and my hand-soldered rectifier/filter control board. Through strategic spatial layout and cable management, I balanced high-performance power output with EMI suppression.

**My Daily Workstation** My daily workstation for rapid prototyping and validation. The setup integrates a Tektronix oscilloscope, DC power supply, and signal generator. By combining complex logic analysis with hardware testing, I can swiftly move from conceptual design to functional physical prototypes.

**Lab Prototyping** A panoramic view of the lab, documenting the birth of a project from scratch. From the scattered structural parts on the left to the precision instruments on the right, every detail represents my relentless exploration of performance boundaries during product iteration.

**BEMF & Hall Sensor Signal Mapping** A logical sketch for defining the phase sequences of a brushless motor (BLDC). I established the phase relationship between BEMF (Back EMF) and Hall Sensor signals (U/V/W), which serves as the fundamental basis for coding Commutation Logic.

**Hardware Power Consumption** Using the high-precision POWER-Z tester, I performed a quantitative analysis of charging efficiency. The setup successfully identified the PD 3.0 protocol and captured dynamic Voltage and Current curves to ensure power consumption met engineering standards.

BUSINESS TRIP

**Wuhan: Tea Break During Team Collaboration** A row of milk teas in a Wuhan meeting room—the perfect recharge after a session of intense discussion and team collaboration.

**Wuhan Station: A Moment of Calm Before Return** Waiting at Wuhan Station with high-speed trains lined up outside. This quiet moment marks the successful completion of one task and the start of the next journey.

**Guangzhou: Journey Through a Rainy Night** A rainy night in Guangzhou, en route to a project site. The neon lights and raindrops on the car window capture the many tireless journeys behind engineering projects.

**Panzhihua: Late Night in the Flower City** A brief pause on the streets of Panzhihua after a long day of on-site debugging. The warm city lights illuminated the way home and witnessed every step of the project’s progress.

**Shenzhen: Fast-Paced Lunch Hour** A snapshot of lunch hour in fast-paced Shenzhen. Here, efficiency is not just in code and hardware, but also in the quick meals and hurried crowds.

EXHIBITION

**ELEXCON Shenzhen International Electronics Show** Attended Elexcon 2023 as a professional audience. My focus was on "High Computing Power & Low Power Consumption" semiconductor solutions, discussing the future of AI intelligence under PPA (Power, Performance, Area) constraints.

**Global MCU Ecosystem Development Summit** Attended the EE Times forum by Aspencore. Participated in deep-dive discussions on motor drive and control seminars, specifically focusing on the integration of Chiplet technology and the MCU ecosystem.

**CHTF: High-end Equipment Manufacturing** At the 25th China Hi-Tech Fair (CHTF), I explored the latest technological achievements in smart equipment, industrial robotics, and additive manufacturing. CHTF is a key window for me to find inspiration in cross-industry technology fusion.

**Motor Drive Forum & Networking** Peer technical exchanges during the exhibition. Through face-to-face discussions with fellow engineers, I gained a more objective view of current project paths and broadened my approach to solving engineering challenges.

**CPSE China Public Security Expo** Attended CPSE 2023 to investigate AI panoramic video one-stop solutions. Focused on the combined application of machine vision and public security systems to explore industry-level AI implementation scenarios.

**CHTF Navigation & Route Planning** Systematically navigating the vast CHTF halls. Through strategic route planning of key exhibition zones, I efficiently gathered comprehensive information across telecommunications, semiconductors, and new energy.

**Cutting-edge Tech Experience at ST booth** Investigated the assisted power bicycle solution featuring NFC WLC technology at the ST booth. This innovative fusion of NFC and wireless charging provided significant inspiration for my subsequent low-power hardware designs.

**STMicroelectronics Welcome Board** Invited to visit the ST booth, focusing on their latest chip solutions for industrial and automotive sectors. As a major semiconductor vendor, ST’s technological evolution is highly instructive for my project architecture design.

EDUCATION

University of Pittsburgh
Pittsburgh, PA, USA | Expected May 2027

Master of Science in Electrical and Computer Engineering
Award: SSOE Dean's Scholarship

Qiqihar University
China | June 2023

Bachelor of Engineering in Mechatronics Engineering

Shenzhen High School of Science
China | June 2019

RECOMMENDATION

XU WU
Vice President | Koryo Electronics Shenzhen

His role as a Field Application Engineer demanded not only technical excellence but also the ability to drive strategic outcomes in high-pressure environments, and he consistently delivered beyond expectations.

WENJIAN LIN
Field Application Engineer | Koryo Electronics Shenzhen

He’s always sharing little hacks or industry insights he picks up from tech events, which makes everyone around him better. In addition, he’s curious, humble, and genuinely loves solving problems.

First Principles Thinker - Building, Solving, and Moving Forward